Monday 12 September 2016

Le Pro 3 with SD 821 Chip, 6GB RAM Expected at Launch Event September21



Chinese tech giant LeEco has officially released notice of a launch event taking place on September 21. The innovative tech company revealed this via a post on China’s social networking website, Weibo, with a theme that seems to suggest that the new device would be a stunner which would change our entire perception of what a flagship phone should be. We had already gotten the wind before now that LeEco is preparing something powerful which would pop in September with top-notch specs.



According to previous rumors, the expected device is the Le Pro 3 which is expected to be the first Chinese smartphone to feature Qualcomm's latesh flagship Snapdragon 821 chipset . The Le Pro 3 is also said to pack 6GB of RAM and 64GB of expandable storage onboard. The flagship Le Pro 3 is also expected to feature a mammoth 5,000 mAH battery and still have a thin body touted to be just 7mm thick. The Le Pro 3 will also rock a 16MP rear camera and an 8MP front camera.

The LeEco Le Pro 3 had earlier appeared on Antutu benchmark , pulling a marvaleous score of 163K ,which is an indication of the power that LeEco has infused on the upcoming flagship device. The score makes this look more powerful than any device we’ve seen lately.

The name of the expected device is a bit confusing as earlier rumors have revealed the phone to be called as the Le 2S Pro. So, we will have to wait and see the name the device will launch with. September 21 

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